Number Title Author T007 Next Generation Ball Bonding Solution for High Power Density Packaging Roy Teo Yi Jing (BE DEV APT LO UPD FOL) T011 Simulation-Based Root Cause Analysis and Mitigation of Wire Bond Distortion in Large Strip Leadframe A2 Plating Yussof Sibra Mallisi (BE DEV APT LO UPD EOL) T019 Enhanced Dynamic PAT Implementation at Backend ETS88D Index Parallel Test Solution Ang Edric (ATV MOS D TE MKZ) T021 Design Driven Test Improvement (D2TI) Tan Beng Rui (ATV SP D PD PTE MKZ TE3) T025 Characterization of Free Air Ball (FAB) and Mashed Ball Properties in Copper (Cu) Wire Bonding Ibrahim Nurul Farhana (BE DEV PWR UPD WMD 2) T028 Ultimate Printing Solution for Multistack Packages Chio Chin Hong (BE DEV PWR UPD DAC 1) T030 S308 Choco Bar Leadlength Cut Tool Design Challenge Anonuevo Dominic Carlos (BE DEV PWR UPD SGL) T034 Innovative Solutions for High Voltage Isolation Testing Challenges in Power Semiconductor Manufacturing Gargaceran Philip Ross Parrenas (BE TTI FT TE PWR) T036 Scalable Low-Cost In-Circuit Test (ICT) Fixture For Post-Soldering MOSFET Verification Zukarnain Muhammad Azfar (PSS CRD TIE TML EVL CVM CV3) T038 Evaluation of Corrosion Mechanisms in Copper Alloy Bonding Wire Under High-Temperature Storage Life (HTSL) Stress Choo Shien Liang (BE DEV APT LO PT) T039 Advance Fiducial Control Securing Package Robustness in MapMold Process Mukhtar Khairurazikin (BE MAL OP E UPE 1 MOLD) T048 Learning DFMEA: A Python-powered RAG Generator for Design FMEA Knowledge Retention Lim Wee Lek (BE DMR AF AAP AAP3) T059 High Thermal Mold Compound Introduction for Double Arc AI Business Chong Meng How (BE DEV PWR UPD MD 1) T062 Robust Mold Process Qualification for HexaDPAK ATV and PSS -Strategies to Overcome Multiple Mold Related Challenges Navaretnasinggam Arivindran (BE DEV PWR UPD MD) T068 New detection method for cracks in Ultra‑Thin Die Assembled in Thin Small No‑Lead (TSNP) Packages Ang Cheong Soo (FE CF QM FA BEA MALPO 1) T069 Systematic Wire Sweep Mitigation Using Innovative TRIZ Problem Solving Method in Backend Assembly Transfer Molding Mohd Tahir Mohd Hirzarul Hafiz (BE DEV PWR UPD MD 1) T070 Accelerating Customer Value Through Intelligent Multi-Binning and End-to-End Digital Traceability in Semiconductor Manufacturing Gan Sunne (BE DMR AF DPM) T079 Gang Diffusion Solder For Multichip Integration in Single Pass Ali Zulsamsul (BE DEV PWR UPD DAH) T089 Multi-Model Confidence-Based Routing for Hybrid Defect Detection and Analysis with AI Chon Chee Hao (BE DEV PWR UPD WMD 2) T090 Factors Influencing the Formation of PbO Flakes and the Solution to Reduce the Contamination on SS06 Karupiah Arvind (BE DEV PWR CPTI) T091 Accelerating Package Miniaturization through Enhanced Wire-Bond Capability Simulation Tan Yan Ru (BE DEV APT LO PT) T093 Next-Gen Packaging: Leveraging REDM for Reliable Packaging Solution and Performance Lee Chai Chee (BE DEV PWR SON PT 1) T095 Introduction of Silane Adhesion Promoter for Multi-Package China Gateway Expansion Marzuki Nor Samsiah (BE DEV PWR UPD WMD) T098 From Manual to Intelligent: A Holistic Digitalization Framework for Semiconductor Package R&D — Tools, Competency and Value Harvesting Yeo Boon Soon (BE DEV PWR UPD WMD 2) T102 Breakthrough Wire Bond Concept with Feasibility in Ribbon Bond for IDPAK Bajuri Mohd Kahar (BE DEV PWR UPD DAC) T104 Accelerating Preventive Maintenance through Automation of Windows Server Patching Telesia Lee Shin Nee (GSD DMS EMA BE MSB) T106 Approaching Speed Of Light – UPH improvement on Pkg Saw Goa Joo Ming (BE DEV PWR UPD SGL 1) T107 Embedded MIS Enabling Future AI Systems and High Performance Applications Tiw Pei Wen Kaylee (BE DEV PWR SON TI) T108 Inhouse Edge-Based Trace Data Collection And Fault Prediction System For Wire Bond Process Using Custom Data Acquisition and Segmentation Models Muniandy Yuvaraaj (BE DMR AF ATD DTT) T111 Enhanced VQFN Leadframe for High Voltage Isolation Cheong Ying Dieh (BE DEV APT LO PT) T113 Beyond Automation: Advancing CT300 Metrology Through Recipe Architecture Innovation Oribello Jr. Diosdado (BE DEV PWR UPD WMD 1) T114 Intentional Bleed for Beam Clip Packages for Quality and Yield Loss Improvement Rosli Muhammad Safie (BE DEV PWR UPD MD) T115 NIR Vision Inspection: Solution for Die Crack Detection for MIS GaN Expose Die AI Product Chin Wen Jun (BE TTI FT DPS TT TH2) T116 Breakthrough Features to Resolve Side Lead Mold Flash Azman Noorazam (BE DEV PWR UPD SGL) T117 Turret – Beckhoff XTS Technology Integration for IDPAK Package Mat Hasan Mohd Firdaus (BE TTI FT DPS TT TH2) T118 Accelerating Innovation-to-Customer Value Through Enhanced Defect Detectability in Advanced Semiconductor Packaging Salihoudin Addin (FE CF QM FA BEA MALPD 2) T119 Higher throughput with New Four Parallel Test Methodology on Turret for Next Level of Productivity Matthew Ee Soon Kiang (BE TTI FT DPS TT TH2) T121 Next-Generation Automotive Reliability: Chocolate-Bar Leadframe Concept with Beam-Lead Gang Clip Architecture Tay Mei