This document is a company profile booklet for the Singapore Pavilion at SEMICON Taiwan 2026, held from 2 to 4 September at TaiNEX Hall 1 and 2 in Taipei. It introduces nine Singapore-based companies in the semiconductor and precision engineering sectors, providing an overview of their capabilities, products, and services for exhibition attendees and industry partners.
This document is a company profile booklet for the Singapore Pavilion at SEMICON Taiwan 2026, a major semiconductor industry exhibition held from 2 to 4 September 2026 at TaiNEX Hall 1 and 2 in Taipei, Taiwan. It is intended for exhibition attendees, industry partners, and potential customers seeking to learn about the capabilities of nine Singapore-based companies in the semiconductor and precision engineering sectors.
The booklet opens with an introduction to SEMICON Taiwan, describing it as a premier global platform for semiconductor companies, equipment manufacturers, and solution providers. It notes the event is expected to attract over 100,000 professionals from 65 countries, with more than 1,300 exhibitors and 4,300 booths, and highlights key themes such as advanced manufacturing, AI, heterogeneous integration, and sustainability.
It then introduces the Singapore Pavilion, which serves as a collective platform for local companies to showcase their technologies and innovations to a global audience. The section also covers the role of Enterprise Singapore, the government agency supporting enterprise development, and the Singapore Precision Engineering and Technology Association (SPETA), which hosts the pavilion and provides on-site staff contact details.
The main body of the document profiles individual companies. Advanced Global Alliance Pte Ltd offers engineering solutions for semiconductor backend manufacturing, including die bonding, vacuum sintering, ultrasonic welding, and X-ray inspection. Inspiraz Technology Pte Ltd specializes in thermal management solutions, such as graphite and graphene-based thermal interface materials, for industries including semiconductors and automotive.
Other profiles include Maxwell Technology Pte Ltd, which manufactures intelligent equipment for advanced packaging and wafer processing; Onn Wah Tech Pte Ltd, a precision tooling supplier for semiconductor back-end packaging; and Oricus Semicon Solutions, which provides turnkey tooling for hybrid bonding and flip chip assembly. Prestige Technology (S) Pte Ltd offers engineering services, project management, and equipment supply across semiconductor, cryogenic, and safety portfolios.
Each company profile lists its booth number, contact details, and specific products or services, such as package saw conversion kits, Kelvin sockets, and cryogenic pipeline gas detection systems. The document concludes with contact information for the pavilion host, SPETA, including a staff email and phone number, to facilitate business inquiries during the exhibition.